The MSD is a moisture-sensitive device, a non-hermetic packaged component made of a moisture permeable material such as plastic, such as a closely spaced component and a ball grid array. When these components are exposed to an elevated temperature environment during reflow soldering, moisture inside the plastic surface mount device (SMD) generates sufficient vapor pressure damage or cracks and the like. In some extreme cases the crack will extend to the surface of the component, the most serious of which is component bulging and component bursting. Therefore, it is very important to carry out moisture-proof packaging treatment for sensitive wet components.

Montmorillonite desiccant is especially suitable for moisture protection of electronic products. The montmorillonite desiccant is made of natural montmorillonite, which is especially suitable for moisture absorption of electronic products. The packaging material is made of DuPont paper, which is safe, durable and anti-static.